Smartphone

2 Step HDI Board

Application Field:Smartphone
Layer Count:10 (2+6+2)
Board Thickness:0.69 ±0.069mm
Line Width /Space:0.075/0.075mm
Lamination:NP NP-155F
Min Hole Size:0.1mm
Aspecter Ratio:2.0576
Surface Treatment :ENIG+OSP