Smartphone

1 step HDI Board

Application Field:Smartphone
Layer Count:6L (1+4+1)
Board Thickness:0.6±0.05mm
Lamination:ITEQ IT158TC
Min Hole Size:0.1mm
Aspecter Ratio:2.374
Line Width /Space:0.072/0.075mm
Surface Treatment:ENIG
Special Process:Laser drilling, antioxidant, outer vacuum etching